Description
•Negative working, aqueous processable dry film photoresist
•Suitable for pattern plate applications on scrubbed and
unscrubbed electroless copper and most Direct Plate surfaces.
•Suitable for print and etch application with acid or alkaline
etching.
•Suitable for some gold plating applications.
•Suitable for some photochemical machining (chemical milling)
application.
•Suitable for tent-and-etch applications
Width: 300mm
Thickness: 38um
Minimal order quantity: 2m
